Difference between Filler Cell and Metal Fill

Figure 1 is the most common physical diagram, only VDD/VSS

Figure 2 shows the Dcap Cell. In addition to the power supply, there will also be some M1 lines, so many companies will add Dcap before routing, otherwise there will be some problems such as short, open, and spacing DRC.

After using metal connection, ordinary Gate Array Filler will be used as a cell with certain functions. Figure 1 shows the layout before connection. The inside of the box is N well, the red is the active area, and the blue bars are poly ; Figure 2 is the layout after connection. Figure 3 and Figure 4 are the display in clb, the two are the same in the base layer, but different in the metal layer.

Or called dummy metal (redundant metal)

In order to prevent coupling with the surrounding lines, the pattern is added section by section, so the home is generally a staggered pattern, but the staggered pattern can only be used when the winding resources are abundant.

Considering the characteristics of electrical appliances, it is better to connect the connection, which is equivalent to a lot of shelding in the design, which reduces the impact of SI, but it will occupy a certain amount of winding resources and requires tradeoff.

After the addition of metal fill, it has little impact on the old process, but has a great impact on the new process. Increased coupling capacitance affects timing. Need to add a little more in the power network, good for IR.

The metal fill on the edge of the block is coupled with the inside, which is easy to miss and requires extra attention.

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